SMD line B

The line consists of:

• Magazine Loader (Asys – VEGO Dynamic AES 01)
• EKRA SERIO 4000 stencil printer
• SAMSUNG DECAN F2
• HELLER 1809 MK5
• PARMI AOI
• Unloader VEGO Dynamic AMS 01
• 2 x ASYS VEGO Compact BC0 conveyor

Fully automatic line for the production of SMD modules, with the capacity of 55 000 components per hour. The entry of the line is equipped with an ASYS PCB Magazine Loader which adds PCB plates from the storage magazine into EKRA. EKRA Serio 4 000 is a stencil printer that is fully programmable and has a print optical inspection, optical adjustment of fiducials and automatic cleaning. The print format is 600 x 400 mm. All line elements are connected with ASYS conveyor which transfers PCB plates to SAMSUNG DECAN F2 and HELLER 1809 MK5 reflow oven.

SAMSUNG DECAN F2 is a Dual Lane and Dual Gantry Pick & Place machine with 10 heads and a speed of 80 000 components per hour. It places components from 0402 to >16mm and with a fixed camera up to >42mm. Components are soldered to PCB plates in the HELLER 1809 MK5 reflow oven which has 9 heating and 2 cooling areas with a transporter chain width up to 450mm, and minimal power consumption. For the optimization process, a Dynamic Profiling system for soldering control is used. After that, the PCB plates pass the optical and electronic inspection PARMI AOI and are stored in the ASYS Unloader which is programmable and adaptable to all kinds of magazines.